Method for minimizing the clogging of a cooling zone heat exchanger in a reflow solder apparatus
US5641341A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1996 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Feb 14, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for minimizing the clogging of a cooling zone heat exchanger of a reflow solder apparatus that includes the steps of: removing a gas/flux mixture from an exhaust zone (20) that is located adjacent a heated zone and/or a cooling zone; conducting the gas/flux mixture to and through a first filter chamber (22), conducting the filtered gas from the filter chamber (22) through a low pressure portion of a blower housing of a cooling zone (16), then subsequently to and through a high pressure portion (44) of the cooling zone that includes a collection tray (38), a mesh filter (48), a heat exchanger (46) and at least one perforated plate (50). The heat exchanger is thermostatically controlled at a preset tempering temperature that minimizes the collection of flux on its exterior surfaces while allowing a solder joint of an article to solidify.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.