Method for particulate-free energy beam cutting of a wafer of die assemblies
US5641416A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 25, 1995 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Oct 25, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for separating FED baseplates or other types of die assemblies from one another without producing any particulate matter or slag that could damage some of the baseplates. In one embodiment a high energy beam is aligned with a cutting line on the wafer that defines a path between the die assemblies along which the wafer is to be cut. At least one of the high energy beam or the wafer is moved in the direction of the cutting line so that the high energy beam passes over the wafer and penetrates the wafer to an intermediate depth along the length of the cutting line. The moving step is then repeated after each pass of the high energy beam over the wafer until the wafer is severed along the cutting path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.