Lead-frame forming material
US5641577A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1995 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Mar 14, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are i) a lead-frame forming material which contains a light-sensitive material comprising (1) a diazo salt light-sensitive resin and (2) a water-insoluble but alkaline water-soluble lipophilic high molecular weight compound, ii) a lead-frame forming material which contains a light-sensitive material comprising a photodimeric light-sensitive composition, and iii) a lead-frame forming material which contains a light-sensitive material comprising (1) a water-insoluble but alkaline water-soluble resin, (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and (3) a compound containing at least one crosslinkable group by the action of the acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.