Method of manufacturing a conductive micro bridge
US5641709A · kind A · utility
9Cited by
7References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1995 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Aug 30, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a conductive micro bridge includes the steps of preparing a semiconductor substrate, forming an insulating film on the semiconductor substrate, forming a sacrificial layer on the insulating film, forming a metal-oxide composite film on the sacrificial layer so as to surround the sacrificial layer, and removing the sacrificial layer to thereby form an air gap in the removed portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.