Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring
US5641713A · kind A · utility
18Cited by
3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 23, 1995 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Mar 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing hermetically cold weld sealed package and method for sealing where a metal seal member 28 is placed along the edge of a base 36, an organic sealant 26 is placed along the outside of the base adjacent the metal seal member 28, and a lid 30 is placed over the base 36 to create a hermetically sealed cavity 46. The process takes place at room temperature environment in an inert environment, and no heating of the metal sealing member 28 is required. The shrinkage of the organic sealant 26 during curing applies pressure to the metal seal member 28, enhancing the effectiveness of the hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.