Patent · US Expired

Polypropylene molding materials

US5641821A · kind A · utility

1Cited by

5References

7Claims

0Family size

Assignee

BASF SE

Inventors

Erhard Seiler · Ludwigshafen, DE
Werner Schone · Schriesheim, DE

Key dates

Filing date	Apr 7, 1995
Grant date	Jun 24, 1997
Priority date	—
Expiry date	Apr 7, 2015

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/1331
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Molding materials comprising PA1 A) polymers of propylene and up to 20% by weight of further monomers, containing PA1 B) from 0.05 to 0.4% by weight of a monofunctional or polyfunctional carboxamide or of a carboxamide mixture having a molecular weight of from 150 to 600 and PA1 c) from 0.1 to 3.0% by weight of an ethylene polymer with up to 20% by weight of comonomers, having a density of from 0.890 to 0.945 g/cm.sup.3 and an MFI of from 10 to 100 g/10 min, measured according to ISO 1133 at 190.degree.C./2.16 kg. The films and moldings produced using the novel molding materials have particularly good frictional properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.