Novolac type epoxy resin and electronic parts encapsulating resin composition
US5641839A · kind A · utility
3Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1995 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Jul 24, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/285
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: ##STR1## (wherein R.sub.1 is hydrogen, halogen, alkyl, or aryl; R.sub.2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.