Hermetically sealed radiation imager
US5641984A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1994 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Aug 19, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
A hermetically packaged radiation imager includes a moisture barrier cover disposed over the imaging array and a hermetic seal structure disposed around the periphery of the moisture barder cover to seal the cover to the underlying substrate. The hermetic seal structure comprises a solder seal disposed in contact with the moisture barrier cover and a dielectric material layer disposed between the solder seal and conductive lines extending from the imager army across the substrate surface. The hermetic seal structure further includes a primer layer that is disposed between the dielectric material layer and the solder seal to provide a foundation to which the solder seal adheres. The dielectric material layer is deposited in an atomic layer epitaxy technique, thus providing a thin layer having high structural integrity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.