Plastic-encapsulated semiconductor device
US5641997A · kind A · utility
336Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1994 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Sep 13, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.