Lead frame and method for manufacturing same
US5643433A · kind A · utility
158Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1993 |
| Grant date | Jul 1, 1997 |
| Priority date | — |
| Expiry date | Dec 23, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3421
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that a connecting portion interconnects the tip ends of inner leads of the electro-deposition pattern formed in the cavity. The connecting piece is maintained while the electro-deposition pattern is separated from the matrix and the resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.