Method of manufacturing a hybrid integrated circuit component having a laminated body
US5643804A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 1994 |
| Grant date | Jul 1, 1997 |
| Priority date | — |
| Expiry date | May 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/938
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a combination thereof formed on the integrated circuit. During the firing of passive circuit element in a hydrogen atmosphere, the semiconductor layer which constitutes the integrated circuit is also heat annealed. Various substrates can be used as the substrate, for example, quartz, ceramic and a cheap semiconductor substrate which has not been treated with a mirror-grinding by the use of a glass layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.