Three-wire-line vertical interconnect structure for multilevel substrates
US5644277A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1995 |
| Grant date | Jul 1, 1997 |
| Priority date | — |
| Expiry date | Nov 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vertical interconnect structure comprising a three-wire-line transmission line structure for providing electrical continuity between different levels of a multilevel substrate. The present invention provides a means for transferring power between various levels of the substrate without introducing excessive additional RE losses. First and second coplanar transmission line structures are disposed on first and second surfaces of the substrate. A vertical interconnect structure is disposed in the multilevel RF substrate and is coupled between the first and second transmission line structures. The vertical interconnect structure comprises three conductors having predetermined cross-sectional dimensions and predetermined separations therebetween that are adapted to transfer RE power between the first and second transmission line structures. In a completed electronic circuit employing the present invention, an electronic device is electrically coupled between two coplanar transmission line structures disposed on one surface of the substrate, and the vertical interconnect structure couples power to the electronic circuit by way of the coplanar transmission line structure disposed anothe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.