Thermal radiant source with filament encapsulated in protective film
US5644676A · kind A · utility
123Cited by
13References
25Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 23, 1995 |
| Grant date | Jul 1, 1997 |
| Priority date | — |
| Expiry date | Jun 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01K1/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrically modulatable radiant source includes an essentially planar substrate, a well or hole formed in the substrate, and at least one incandescent filament attached to the substrate. The incandescent filament is aligned with the well or hole and is formed of a metallic compound which readily oxidizes at an operating temperature of the incandescent filament. An oxidation resistant film encapsulates the incandescent filament to prevent the filament from oxidizing. Furthermore, contact pads are formed on the substrate at both ends of the incandescent filament for feeding electric current to the incandescent filament.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.