Process for assembling electronics using microwave irradiation
US5644837A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jun 30, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a process for assembling electronics which allows for rapid heating and fast curing, and avoids subjecting the components to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins, having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.