Method and apparatus for plasma treatment of a surface
US5645645A · kind A · utility
271Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1996 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jun 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3327
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A radiofrequency wave apparatus and method which provides a relatively high concentration of reactive species from a plasma for the treatment of a surface particularly of a substrate (31) with a complex geometry in a holder (62) which masks a portion of the substrate. The radiofrequency waves are preferably microwaves or UHF waves. The apparatus and method is particularly useful for rapid plasma assisted chemical vapor deposition of diamond on a portion of the substrate, particularly on surfaces of objects with complex geometries such as a drill (60) or a seal ring (64).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.