Multilayer high vertical aspect ratio thin film structures
US5645684A · kind A · utility
119Cited by
14References
39Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0728
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures. Various material properties may be varied within the structures to produce electrical, mechanical or electromechanical devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.