Dual cylindrical target magnetron with multiple anodes
US5645699A · kind A · utility
48Cited by
9References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 21, 1996 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jun 21, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Two adjacent rotating cylindrical targets are used in a specific form of a vacuum sputtering system to deposit a film of material onto a substrate. Elongated anodes are provided on opposite sides and in between the targets in a manner to make more uniform the rate of deposition across the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.