Electrically conductive pressure sensitive adhesives
US5645764A · kind A · utility
40Cited by
4References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jan 19, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J9/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrically conductive pressure sensitive adhesive containing electrically conductive polymers used as an alternative to metallic solder in interconnect electronic applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.