Electrified object contact component
US5645943A · kind A · utility
0Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Oct 20, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrified object contact material characterized in that an oxide film formed in a high purity oxidizing atmosphere with a thickness from several tens to 100 .ANG. is formed at least in a section directly contacting an electrified object. By using the contact component according to the present invention, the electric potential of a wafer can always be suppressed to 50 V or less, and moreover, contamination of a wafer (especially by a metallic material) can completely be eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.