Equipment and method for applying a liquid layer
US5646071A · kind A · utility
19Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jan 19, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for applying a liquid to the surface of semiconductor wafer are described. The wafer is rotated about an axis; perpendicular to its main surface. Liquid is dispensed onto the surface of the spinning wafer from at least two dispensing bottles. One of the dispensing bottles is positioned above the center of rotation while the others are located between it and the wafer's edge. The rate at which liquid emerges from each of the dispensing bottles is independently controlled for each bottle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.