Apparatus and method for mounting a component to an electrical circuit
US5646444A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1995 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Oct 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus to improve upon the problem of mismatched CTEs in electrical circuits comprises a small heat sink (206), a substrate (202), and an aperture existing within the substrate (202). The heat sink (206) is located on one side of the substrate (202) in a location substantially overlapping the aperture (204). The transistor (106) is coupled to the heat sink (206) and extends through the aperture (204). The apparatus reduces manufacturing costs since no exotic bonding agents are needed to accommodate for the mismatch in CTEs. Additionally, the apparatus reduces the number of substrates required during the manufacturing process, and allows for the heat sink (206) to be soldered in an automated fashion to the bottom of the substrate (202) in much the same way component parts are reflowed onto the top of a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.