Top loading cam activated test socket for ball grid arrays
US5646447A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1996 |
| Grant date | Jul 8, 1997 |
| Priority date | — |
| Expiry date | Jun 3, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A socket for a ball grid array integrated circuit package (BGA) with an array of electrical contacts (*12) that extend through holes in a slidable plate. The arrangement of spacing the holes (14) and the electrical contacts therein provide entry openings that allow the ball contacts (16) of a BGA package to enter the openings. The contacts are cupped or angled to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is vertically inserted into the socket without any interfering structure, and there are guide surfaces to align the ball contacts with the openings. The plate (3) is driven parallel to the plane of the ball contacts in a manner that reduces the entry hole opening by means of a rotating cam placed at one end rotated by a torsion spring. This reduced entry opening is arranged and constructed such that with a ball contact inserted therein, electrical conductivity is provided between the ball contact and the socket electrical contact, and further contact occurs where the cupped ends are bifurcated with sharp edges that penetrate any oxidation on the ball contacts. The angled or cupped ends (24) of …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.