Manufacturing method for an integrated circuit card
US5647122A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1995 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | Jun 14, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electronic card comprises an electrically insulating card support provided with a cavity for accommodating an integrated circuit and, on one surface, with metal contact pads which are electrically connected to contacts of the integrated circuit. The invention comprises the steps of: (i) the application by an MID technique (Moulded Interconnection Devices) of electrical conductor tracks, all arranged on the bottom and the lateral walls of the cavity, and each connected to one of the metal contact pads arranged on the surface of the support which comprises the cavity, (ii) the realization of electrical connections connecting the contacts of the integrated circuit arranged in the cavity to the conductor tracks on the bottom of the cavity, and (iii) filling up of the cavity with a protective resin which is subsequently polymerized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.