Electronic component cooling unit
US5647430A · kind A · utility
53Cited by
15References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 1996 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | Mar 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In an electronic component cooling unit, one surface of a cold plate, on the other surface of which an electronic component is mounted, is covered with a cover member to form a tank section which accommodates refrigerant, and a pipe member is fitted in the cover member in such a manner as the pipe member is communicated with the tank section. Furthermore, the one surface of the cold plate has a recess which forms the tank section together with the cover member. The pipe member is a multi-flow-path container which is formed by extrusion molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.