Method of controlling the temperature of a portion of an electronic part during solder reflow
US5647529A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1995 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | Mar 10, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.