Heat resistant adhesives for adhering mailer windows
US5648143A · kind A · utility
92Cited by
16References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1991 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | Oct 28, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31895
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A window-containing mailer is provided which is suitable for use in nonimpact printers using heated fuser rolls. A heat and moisture resistant adhesive which resists picking at temperatures encountered in the fusing rolls secures a transparent polymeric film or glassine patch to the mailer substrate. The adhesive may be either a crosslinkable aqueous-based latex or emulsion or a radiation curable composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.