Thermal management of electronic components using synthetic diamond
US5648148A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 1995 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | May 17, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-sinked electronic component includes a first layer of synthetic diamond having a relatively low thermal conductivity. A second layer of synthetic diamond is adjacent the first layer, the second layer of synthetic diamond having a relatively high thermal conductivity, the second layer being thinner than the first layer. An electronic component is mounted on the second layer of synthetic diamond. In a disclosed embodiment, the thermal conductivity of the diamond of the second layer is at least fifteen percent higher than the thermal conductivity of the diamond of the first layer, and the first layer is at least twice as thick as second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.