Epoxy resin mixtures containing phosphorus acid/epoxy resin adducts

US5648171A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang von Gentzkow · Kleinsendelbach, DE
• Jürgen Huber · Erlangen, DE
• Heinrich Kapitza · Fürth, DE
• Wolfgang Rogler · Erlangen, DE
• Hans-Jerg Kleiner · Kronberg, DE

Key dates

• Filing date: Sep 14, 1995
• Grant date: Jul 15, 1997
• Expiry date: Sep 14, 2015

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31525
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, and an aromatic polyamine as the hardener.