Polyamide resin composition
US5648423A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1995 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | Apr 5, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The polyamide resin composition of the present invention comprises 100 parts by weight of a polyamide resin and 5 to 200 parts by weight of a graft-modified ethylene/1-butene random copolymer having a graft quantity of an unsaturated carboxylic acid or its derivative of 0.01 to 10% by weight. The graft-modified ethylene/1-butene random copolymer is a graft-modified product of an ethylene/1-butene random copolymer having a 1-butene content of 15 to 25% by mol, an intrinsic viscosity [.eta.] of 0.5 to 3.5 dl/g, a glass transition temperature (Tg) of not higher than -60.degree. C., a crystallinity of less than 10%, and a parameter (B value) indicating randomness of a copolymerized monomer chain distribution, as measured by a .sup.13 C-NMR method, of 1.0 to 1.4. The polyamide resin composition shows high melt flowability, namely, good moldability, and it can provide a molded article excellent in flexibility, low-temperature impact resistance, resistance to water absorption and resistance to saline solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.