Curable fluoroelastomeric compositions
US5648429A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 1995 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | May 25, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable flurooelastomeric compositions used for O-rings comprising: PA1 A) parts (phr) of a curable fluoroelastomeric copolymer having a content in F<67% by weight and comprising from 40 to 68% by weight of VDF units, from 20 to 50% by weight of HFP units, the sum being 100, and optionally one or more comonomers having ethylene unsaturation, said copolymer having a number of ionic terminals of at least 0.5 for chain; PA1 B) from 1 to 5 phr of an adduct between an accelerator and a curing agent in molar ratio from 1:3 to 1:5, the accelerator being an onio-organic compound having a positive charge, the curing agent being a di- or polyhydroxy or di- or polythiol compound; the adduct being obtained by melting of the reaction product between accelerator and curing agent in the indicated molar ratios, or by melting of the adduct mixture 1:1 added with the curing agent in the indicated amounts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.