Field emission devices employing improved emitters on metal foil and methods for making such devices
US5648699A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1995 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | Nov 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2201/30457
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides improved methods for making field emission devices by which one can pre-deposit and bond the diamond particles or islands on a flexible metal foil at a desirably high temperature (e.g., near 900.degree. C. or higher), and then subsequently attach the high-quality- emitter-coated conductor foil onto the glass substrate. In addition to maximizing the field emitter properties, these methods provide high-speed, low-cost manufacturing. Since the field emitters can be pre-deposited on the metal foil in the form of long continuous sheet wound as a roll, the cathode assembly can be made by a high-speed, automated bonding process without having to subject each of the emitter-coated glass substrates to plasma heat treatment in a vacuum chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.