Patent · US Expired

Large integrated circuit with modular probe structures

US5648730A · kind A · utility

17Cited by
15References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 30, 1994
Grant dateJul 15, 1997
Priority date
Expiry dateNov 30, 2014

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F11/2733
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A large integrated circuit (10) of modular design, each module (12,14,16) having a circuit section (22,24,34) and a separate dedicated testing pad section (20). Each circuit module (12,14,16) can be individually functionally tested as an independent circuit with conventional prober equipment for defects. Each testing pad section (20) facilitates controlling the entire integrated circuit (10) so that the respective module circuit section (12,14,16) can be tested. Control circuitry (26) comprised of pass gates is provided to isolate the testing pad sections (20) from the operational portion (22,24,34) of the integrated circuit (10) when not under test. The present invention is ideally suited for large spatial light modulators, memory devices and other large sophisticated integrated circuits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.