Attachment device for semiconductor circuit elements
US5648889A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 15, 1995 |
| Grant date | Jul 15, 1997 |
| Priority date | — |
| Expiry date | Sep 15, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive device basically consists of a T-shaped cooling element (2), divided into a rib (14) and a crossplate (16), with said device secured to the circuit board (1) by means of screws (9). The base plate (6) of a spring element (15) is inserted between the rib (14) of the cooling element (2) and the circuit board (1). This base plate (6) is equipped with at least one spring tab (7) on each side. The rib (14) is equipped with threaded openings (11) that are flush with the openings in the base plate (6). The base plate (6) is equipped with an angled tab (12) at each end that is adjusted to the corresponding opening in the circuit board (1) for precise positioning of the base plate (6). The semiconductors (3, 4) that are to be attached and that are soldered to electrical connectors (5) are pressed against the surface of the crossplate (16) facing the circuit board by means of the spring tabs (7). Depending on the potential position of the semiconductor (3, 4) or the design of its housing, an insulation platelet (8) is inserted in between the semiconductor (3, 4) and the crossplate (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.