Heat treating apparatus and method
US5650026A · kind A · utility
3Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1995 |
| Grant date | Jul 22, 1997 |
| Priority date | — |
| Expiry date | Dec 6, 2015 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2019/0037
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A plurality of treatment station includes a plurality of heat treatment portions and staging portions. The staging portions utilize non-contact temperature sensors to measure an intensity of infrared radiation emitted from a part to be heat treated. A plurality of wavelengths of infrared energy emitted from a part are read with the wavelengths used as inputs to an empirical equation to calculate an apparent actual temperature of the part. The staging portions and the heat treatment portions are shielded to prevent infrared energy from the heat treatment portion from interfering with the accuracy of the staging portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.