Method of making a multilayer electronic component with inter-layer conductor connection utilizing a conductive via forming ink
US5650199A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1995 |
| Grant date | Jul 22, 1997 |
| Priority date | — |
| Expiry date | Nov 22, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0783
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered electronic component created by a wet process, wherein a ceramic base is imprinted with an electrode and an interlayer via is formed on top of it by introducing a via pattern printed in ink that is incompatible with a layer of wet ceramic slurry coating placed on top of the electrode and the via pattern. The incompatibility leads to a physical-chemical reaction that removes ceramic material away from the top of the via pattern by diffusing ceramic materials contained in a colloidal suspension forming a via-through hole. After the wet ceramic slurry is dried, it surrounds the via-through hole and the imprinted via pattern. Then a new electrode layer is imprinted on top of the dried ceramic coating. The new electrode layer completes an electrically conductive path formed from the bottom-most electrode layer, to the via pattern, and then terminating at the new electrode layer on top.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.