Patent · US Expired

Direct bonded heat spreader

US5650662A · kind A · utility

84Cited by

2References

18Claims

0Family size

Inventors

Steven F. Edwards · Dallas, US
Peter Maier · Rielasingen-Worblingen, DE
Jurgen Shultz-Harder · Achern, DE

Key dates

Filing date	Aug 19, 1994
Grant date	Jul 22, 1997
Priority date	—
Expiry date	Aug 19, 2014

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A heat spreader formed of copper or copper alloys is direct bonded to an electronic device package which includes a multilayer substrate formed of alternating layers of ceramic and metallic plating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.