Patent · US Expired

Process for engineering coherent twin and coincident site lattice grain boundaries in polycrystalline materials

US5651839A · kind A · utility

128Cited by
10References
11Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 26, 1995
Grant dateJul 29, 1997
Priority date
Expiry dateOct 26, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S505/742
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A process for producing coherent twin, incoherent twin, low angle tilt, high angle tilt or CSL grain boundaries in materials is described. A planar material or a planar substrate coated with the polycrystalline material is heated in selected areas so as to provide a temperature gradient in the substrate. The temperature gradient is sufficiently large and maintained for a sufficient time so that preferential nucleation occurs and recrystallization in the plane of the polycrystalline material takes place such that coherent twin, incoherent twin, low angle tilt, high angle tilt or CSL boundaries between chains of grains growing along lines of equal temperature are produced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.