Matched low dielectric constant, dimensionally stable adhesive sheet
US5652055A · kind A · utility
61Cited by
36References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1995 |
| Grant date | Jul 29, 1997 |
| Priority date | — |
| Expiry date | Apr 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is an improved adhesive sheet (also known as a "bond ply," "bond film," or "prepreg") material suitable for bonding together electric circuit boards and other electrical components. The adhesive sheet of the present invention comprises a combination of a porous expanded polytetrafluoroethylene (PTFE), a ceramic filler, and a thermoset resin imbibed within the porous PTFE structure. By employing a fill of less than about 60% by weight of resin, the adhesive sheet has exceptionally good performance characteristics while being vastly easier to process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.