Heat-curable epoxy resin systems having a good reactivity/stability ratio
US5652322A · kind A · utility
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3References
2Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 17, 1996 |
| Grant date | Jul 29, 1997 |
| Priority date | — |
| Expiry date | Sep 17, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/72
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-curable epoxy resin systems comprising PA1 (a) at least one epoxy resin, PA1 (b) at least one polycarboxylic acid anhydride, and PA1 (c) 1,4-diazabicyclo(2,2,2)octane or a C.sub.1 -C.sub.4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane as curing accelerator, and wherein one portion of the curing accelerator (c) is replaced by PA1 (d) a complex of a boron halide with an amine, have good reactivity at elevated temperatures and comparatively high stability at temperatures below c. 80.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.