Epoxy resin high in ortho bisphenol F
US5654382A · kind A · utility
10Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1995 |
| Grant date | Aug 5, 1997 |
| Priority date | — |
| Expiry date | Jun 30, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/245
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin prepared from a component comprising a bisphenol F having high ortho isomer content is claimed. Ortho isomer content is defined as follows: EQU (A+2B)/2 A: content of ortho-para isomer of a bisphenol F O: content of ortho-ortho isomer of a bisphenol F The epoxy resin of the present invention has lower viscosity (e.g. melt viscosity, solution viscosity) and good physical properties (e.g. flexibility), and suitable for various applications such as coating materials, electrical laminates, adhesives, molding products, encapsulation materials, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.