Optical coupling device and method for manufacturing the same

US5654559A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Werner Spaeth · Holzkirchen, DE
• Norbert Stath · Regensburg, DE
• Ernst Nirschl · Wenzenbach, DE
• Walter Wegleiter · Nittendorf, DE
• Werner Kuhlmann · Stephanskirchen, DE
• Rudolf Buchberger · Munich, DE

Key dates

• Filing date: Apr 25, 1996
• Grant date: Aug 5, 1997
• Expiry date: Apr 25, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48463
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An optical coupling device and method for manufacturing the same is disclosed wherein a light-emitting semiconductor transmitter chip is secured to a light-detecting semiconductor receiver chip via a transparent insulating layer, a structured spacer layer and a transparent connecting layer. The resultant optocoupler has a high coupling factor and may be reliably manufactured into SMT compatible packages.