Forming rigid circuit board
US5655291A · kind A · utility
5Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1995 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Jun 26, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for forming a rigid circuit board uses a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has two rollers used to form the bend region to a predetermined shape. When the circuit is cooled, the circuit board again becomes rigid in its predetermined shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.