Apparatus for coating substrates
US5656141A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 1996 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Feb 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3137
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus for coating substrates 31, 31", . . . in a vacuum chamber 2 including a substrate carrier 30 disposed therein and a device 29 for generating a first plasma cloud 28 and, further, including magnets 26, 27 directing the plasma cloud 28 onto the surface of the substrates 31, 31" . . . wherein this device for generating the plasma cloud 28 has an election emitter 11 and a downstream tubular anode 38, the anode has an inlet 10 for the process gas to ignite the plasma and, further, the device is provided with magnets 4, 7 for directing and guiding the plasma through the anode tube 38 into the process chamber 43 and including a device for generating atoms, molecules or clusters of the materials for producing a layer on the substrates 31, 31", . . . , preferably an electron beam evaporator 37 from which the evaporated or sputtered material 33 can be directly applied onto the substrates 31, 31" . . . . A second plasma 60 is generated between the crucible 45 of the electron beam evaporator 37 and the anode tube 38 of the plasma source 29 by applying a potential difference between the plasma source 29 and the vacuum chamber 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.