Process for producing circular, buried waveguides and the associated devices
US5656181A · kind A · utility
6Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1995 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Jul 3, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12176
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The process for the preparation of a waveguide buried in a glass substrate according to the invention consists of the following stages: PA1 a stage of producing a waveguide (28, 38) by ion exchange on the surface of each of two glass substrates (22, 32), PA1 a stage of aligning both substrates, so that the surfaces in which the waveguides have been produced face one another, PA1 a direct wafer bonding stage of the two substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.