Coating compositions and their use as solder resists
US5656411A · kind A · utility
2Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1994 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Feb 23, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-part system for the preparation of a thermally curable coating composition, in which one-pack contains a thermally curable material and the other contains a curing system potentially reactive therewith, at least one of the packs having water as the principal liquid carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.