Method and apparatus for fabricating weak link junctions on vicinally cut substrates
US5656575A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 13, 1995 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Feb 13, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/702
Abstract
The present invention provides a superconducting device having a weak link junction with an angle at the grain boundary between the two superconductor crystals being variable. The angle at the junction is substantially equivalent to a vicinal angle for the substrate. Accordingly, the magnitude of the angle at the junction can be varied by varying the vicinal angle of the substrate. This result can be realized by using buffer layers of different compositions underlying the superconducting materials on either side of the weak link junction. Weak link junctions and reproducible properties are essential for a variety of electronic and magnetic sensing devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.