Tab tape-based bare chip test and burn-in carrier
US5656941A · kind A · utility
10Cited by
3References
15Claims
0Family size
Inventors
Key dates
| Filing date | Feb 14, 1995 |
| Grant date | Aug 12, 1997 |
| Priority date | — |
| Expiry date | Feb 14, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0475
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
TAB tape is used to contact integrated circuit chip electrodes (without actual metallurgical bonding) at approximately 10 grams per lead contact force. The chip is clamped to the TAB leads, and held in place so that the tape site can be transported, tested, and burned-in like a TAB chip on tape. A TAB tape frame is utilized with the inner lead bond fingers angled upwards so that the ends of the fingers perform a scrubbing action on the chip contacts when the IC chip is engaged with the TAB tape slide carrier socket. A silicone bead provides a spring-like action underneath the fingers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.