Fabrication of thermal ink-jet feed slots in a silicon substrate
US5658471A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1995 |
| Grant date | Aug 19, 1997 |
| Priority date | — |
| Expiry date | Sep 22, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1646
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Improved methods for fabricating the ink feed slots in silicon substrate for use in thermal ink-jet print heads is disclosed. One method involves the partial anisotropic etching of an ink feed slot in a silicon substrate for use in aligning the electrical resistive elements on one surface of the substrate. Another embodiment involves laser drilling alignment holes and anisotropically etching the substrate. In both methods, at least one photoresist masking and development step is eliminated thereby reducing fabrication time and alignment difficulties for locating the feed slots relative to the electrical resistance elements and increasing product yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.