ABS moulding compounds with improved yield stress
US5658985A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1996 |
| Grant date | Aug 19, 1997 |
| Priority date | — |
| Expiry date | Feb 16, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L23/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding composition, containing: A) 5-95 weight percent of a thermoplastic homo-, co-, or terpolymer of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof; B) 5-95 weight % of a graft polymer of B.1) 5-90 parts by weight of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof on B.2) 95-10 parts by weight of a rubber with a glass transition temperature .ltoreq. 10.degree. C; and C) 0.1-10 parts bye weight per 100 parts by weight of A+B of one or more EPM and/or EPDM rubbers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.