Patent · US Expired

ABS moulding compounds with improved yield stress

US5658985A · kind A · utility

25Cited by
12References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 16, 1996
Grant dateAug 19, 1997
Priority date
Expiry dateFeb 16, 2016

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L23/16
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Thermoplastic molding composition, containing: A) 5-95 weight percent of a thermoplastic homo-, co-, or terpolymer of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof; B) 5-95 weight % of a graft polymer of B.1) 5-90 parts by weight of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof on B.2) 95-10 parts by weight of a rubber with a glass transition temperature .ltoreq. 10.degree. C; and C) 0.1-10 parts bye weight per 100 parts by weight of A+B of one or more EPM and/or EPDM rubbers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.