Resin sealed semiconductor device
US5659199A · kind A · utility
10Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1996 |
| Grant date | Aug 19, 1997 |
| Priority date | — |
| Expiry date | Apr 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin sealed semiconductor device includes a lead frame having a die pad; a semiconductor element mounted on the die pad; a resin sealing the lead frame and the semiconductor element, the die pad including a plurality of through holes where the semiconductor element is mounted; and a resin film bonding the semiconductor element to the die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.